JPH02146144U - - Google Patents
Info
- Publication number
- JPH02146144U JPH02146144U JP1989055030U JP5503089U JPH02146144U JP H02146144 U JPH02146144 U JP H02146144U JP 1989055030 U JP1989055030 U JP 1989055030U JP 5503089 U JP5503089 U JP 5503089U JP H02146144 U JPH02146144 U JP H02146144U
- Authority
- JP
- Japan
- Prior art keywords
- embossed
- adhesive
- sheet
- separator
- adhesive surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989055030U JPH02146144U (en]) | 1989-05-12 | 1989-05-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989055030U JPH02146144U (en]) | 1989-05-12 | 1989-05-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02146144U true JPH02146144U (en]) | 1990-12-12 |
Family
ID=31577620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989055030U Pending JPH02146144U (en]) | 1989-05-12 | 1989-05-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02146144U (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2020255975A1 (en]) * | 2019-06-19 | 2020-12-24 | ||
US12398298B2 (en) | 2018-11-09 | 2025-08-26 | Resonac Corporation | Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5978285A (ja) * | 1982-10-28 | 1984-05-07 | Mitsui Toatsu Chem Inc | 粘着フイルム |
JPS6148204A (ja) * | 1984-08-16 | 1986-03-08 | Akai Electric Co Ltd | テ−プレコ−ダ用バイアス発振器 |
JPS6211948U (en]) * | 1986-05-23 | 1987-01-24 |
-
1989
- 1989-05-12 JP JP1989055030U patent/JPH02146144U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5978285A (ja) * | 1982-10-28 | 1984-05-07 | Mitsui Toatsu Chem Inc | 粘着フイルム |
JPS6148204A (ja) * | 1984-08-16 | 1986-03-08 | Akai Electric Co Ltd | テ−プレコ−ダ用バイアス発振器 |
JPS6211948U (en]) * | 1986-05-23 | 1987-01-24 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12398298B2 (en) | 2018-11-09 | 2025-08-26 | Resonac Corporation | Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device |
JPWO2020255975A1 (en]) * | 2019-06-19 | 2020-12-24 |